NEN EN IEC 60191-6-2 : 2002
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
Published date
12-01-2013
Publisher
Includes the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages and as well as for column terminal packages.
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