NEN EN IEC 60749-20 : 2009
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Published date
12-01-2013
Publisher
Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-20:2008 | Identical |
| EN 60749-20:2009 | Identical |
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