NEN EN IEC 60749-22 : 2003
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
Published date
12-01-2013
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Applies to the wire-to-die bond, wire-to-substrate bond, or the wire-to-terminal bond inside the package of wire-connected semiconductor devices bonded by soldering, thermocompression, ultrasonic and other related techniques.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-22:2002 | Identical |
| EN 60749-22:2003 | Identical |
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