Credit card payment only is accepted for this order because it contains a mix of both publications and training products.
Invalid username/password. Please try again.
xyz
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
:
Available format(s):
Language(s):
Published date: 12-01-2013
Publisher: Netherlands Standards
Applies to the wire-to-die bond, wire-to-substrate bond, or the wire-to-terminal bond inside the package of wire-connected semiconductor devices bonded by soldering, thermocompression, ultrasonic and other related techniques.
Sorry this product is not available in your region.
Unfortunately, this product is not available for purchase in your region.
Features
Get in touch with us
Loading..
A free alerting service to track changes to standards.
Once you've completed your purchase you'll get a link to My Orders on: -the Confirmation page of check out -and by email You'll be able to access your Multi User Orders to add Users.
You have selected more than three (3) participants. Please contact our Customer Service team.
You have already added this product in the cart. If you would like to add additional copies of this product please adjust the Quantity in the cart. For more than 10 copies, please contact our Customer Support team on +353 (0)1 857 6730.
You have selected more than three (3) trainings. Please contact our Customer Service team.Please contact our Customer Service team on Email: sales@saiglobal.com Phone: 131 242 (Within Australia)
You have already added a product with different Currency. Please change the currency.
This product cannot be added to your cart right now. Please contact our Customer Service team on Email: info@standards.iePhone: +353(0)1 857 6730
You have already saved 6 Quotes. Please contact our Customer Service Team.