NEN EN IEC 60749-34 : 2011
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
Published date
12-01-2013
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Explains a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors.
DocumentType |
Standard
|
PublisherName |
Netherlands Standards
|
Status |
Current
|
Standards | Relationship |
EN 60749-34:2010 | Identical |
IEC 60749-34:2010 | Identical |
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