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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
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Published date: 12-01-2013
Publisher: Netherlands Standards
Covers information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.
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