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NEN EN IEC 61189-3-719 : 2016

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING

Published date

06-06-2016

Defines a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
EN 61189-3-719:2016 Identical
IEC 61189-3-719:2016 Identical

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