NEN EN IEC 61189-3-719 : 2016
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The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
Published date
06-06-2016
Publisher
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Defines a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-3-719:2016 | Identical |
| IEC 61189-3-719:2016 | Identical |
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