NEN EN IEC 61190-1-2 : 2014
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Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Published date
12-01-2013
Publisher
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Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 61190-1-2:2014 | Identical |
| IEC 61190-1-2:2014 | Identical |
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