NEN EN IEC 62047-18 : 2013
Current
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The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
Published date
23-10-2013
Publisher
Defines the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 [mu]m and 10 [mu]m.
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