NEN EN IEC 62137-1-3 : 2009
Current
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
Published date
12-01-2013
Publisher
Applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62137-1-3:2008 | Identical |
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