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SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
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Published date: 12-01-2013
Publisher: Netherlands Standards
Applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. It also evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.
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