NEN EN IEC 62137-4 : 2015 C11 2015
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ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
Published date
20-04-2015
Publisher
Defines the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
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