NEN EN IEC 62258-6 : 2006
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
Published date
12-01-2013
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Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
| DevelopmentNote |
Supersedes NEN NPR ES 59008-4-3. (10/2006)
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62258-6:2006 | Identical |
| EN 62258-6 : 2006 | Identical |
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