NEN IEC 60191-5 : 1998
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 5: RECOMMENDATIONS APPLYING TO INTEGRATED CIRCUIT PACKAGES USING TAPE AUTOMATED BONDING (TAB)
Published date
12-01-2013
Publisher
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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions.
| DevelopmentNote |
Supersedes NEN NPR 10191-5. (09/2002)
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60191-5:1997 | Identical |
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