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NEN NPR IEC/TR 62866 : 2014

Current

Current

The latest, up-to-date edition.

ELECTROCHEMICAL MIGRATION IN PRINTED WIRING BOARDS AND ASSEMBLIES - MECHANISMS AND TESTING

Published date

27-05-2014

Explains the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
IEC TR 62866:2014 Identical

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