NF EN 14607-1 : 2004

Foreword
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
  3.1 Terms and definitions
  3.2 Definitions for unit internal thermal design
  3.3 Abbreviated terms
4 Requirements
  4.1 Mission
      4.1.1 General
      4.1.2 Ground and pre-launch
      4.1.3 Launch and ascent
      4.1.4 Planetary orbital phases
      4.1.5 Interplanetary phases
      4.1.6 Docking, docked and separation phases
      4.1.7 Descent, (re-)entry and landing
      4.1.8 Post-landing phases
  4.2 Performance
      4.2.1 General
      4.2.2 Temperatures
      4.2.3 Functionality
      4.2.4 Additional and other performance requirements
  4.3 Interfaces
      4.3.1 General
      4.3.2 Mechanical interface
      4.3.3 Electrical interface
      4.3.4 AOCS interface
      4.3.5 TM/TC interface
      4.3.6 OBDH and S/W interface
      4.3.7 Launcher interface
      4.3.8 GSE interface
  4.4 Design
      4.4.1 General
      4.4.2 Budgets
      4.4.3 Parts, materials and processes (PMP)
      4.4.4 EEE components
      4.4.5 Lifetime
      4.4.6 Predictability and testability
      4.4.7 Flexibility
      4.4.8 Accessibility
      4.4.9 Reliability
      4.4.10 Redundancy
      4.4.11 Interchangeability
      4.4.12 Maintenance
      4.4.13 Cleanliness
      4.4.14 Safety
      4.4.15 Availability
  4.5 Verification
      4.5.1 General
      4.5.2 Review of design
      4.5.3 Verification by similarity
      4.5.4 Verification by inspection
      4.5.5 Verification by analysis
      4.5.6 Verification by test
      4.5.7 Thermal Balance (TB) test
  4.6 Production and manufacturing
      4.6.1 General
      4.6.2 Manufacturing process
      4.6.3 Manufacturing drawings
      4.6.4 Quality management
      4.6.5 Cleanliness
      4.6.6 Procurement
      4.6.7 Tooling
      4.6.8 Integration
      4.6.9 Marking
      4.6.10 Packaging, handling, transportation
      4.6.11 Storage
      4.6.12 Repair
      4.6.13 In-service requirements
  4.7 Product assurance
  4.8 Deliverables
      4.8.1 General
      4.8.2 Hardware
      4.8.3 Documentation
  4.9 Use standard to define project requirements
Annex A (normative) Development approach
      A.1 Uncertainties
          A.1.1 Uncertainty philosophy
          A.1.2 Sources for temperature uncertainties
          A.1.3 Sensitivity analysis and temperature uncertainty
      A.2 Margins
      A.3 Test approach and test success criteria
          A.3.1 Test approach
          A.3.2 Test success criteria
      A.4 Correlation approach and correlation success criteria
          A.4.1 General
          A.4.2 Temperature level criteria
          A.4.3 Standard deviation criteria
          A.4.4 Individual unit success criteria
      A.5 Analysis approach
          A.5.1 Objectives of thermal analysis
          A.5.2 Thermal analysis methods
          A.5.3 Interfaces and deliverables
          A.5.4 Quality
Annex B (normative) Cryogenic temperature range
      B.1 Applicability
          B.1.1 General
          B.1.2 Cryogenic definitions (exceptions)
      B.2 Complementary terminology for the cryogenic temperature
          range
      B.3 Applicability matrix
Annex C (normative) High temperature range
      C.1 Applicability
      C.2 Complementary terminology for the high temperature range
      C.3 Applicability matrix
Annex D (informative) TCS development methodology
      D.1 Conventional temperature range
          D.1.1 General
          D.1.2 First stage (preliminary) configuration
          D.1.3 Final thermal design
          D.1.4 Reason for thermal analyses
          D.1.5 Typical parameter inaccuracies
      D.2 Cryogenic temperature range
          D.2.1 General
          D.2.2 Reason for thermal analyses
          D.2.3 Typical parameter inaccuracies
Bibliography