NF EN 60191-6-2 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
12-01-2013
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
1,00 mm pitch
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
| DevelopmentNote |
Indice de Classement: C96-013-6-2 PR NF EN 60191 6-2 MAY 2002 (04/2002)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-6-2:2002 | Identical |
| UNE-EN 60191-6-2:2003 | Identical |
| EN 60191-6-2:2002 | Identical |
| DIN EN 60191-6-2:2002-09 | Identical |
| IEC 60191-6-2:2001 | Identical |
| I.S. EN 60191-6-2:2002 | Identical |
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