NF EN 61189-3-719 : 2016
Current
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
Published date
15-12-2014
Publisher
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DevelopmentNote |
Indice de classement: C93-733-719. PR NF EN 61189-3-719 November 2014. (12/2014)
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DocumentType |
Standard
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PublisherName |
Association Francaise de Normalisation
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Status |
Current
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Standards | Relationship |
EN 61189-3-719:2016 | Identical |
IEC 61189-3-719:2016 | Identical |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
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