NF EN 61190-1-3 :2008
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Amended by
Published date
01-05-2008
Publisher
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| EN 61190-1-3:2007 | Identical |
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