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  • NF EN 61190-1-3 :2008

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    Available format(s):  Hardcopy

    Language(s):  English - French

    Published date:  01-05-2008

    Publisher:  Association Francaise de Normalisation

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    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current
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