![header thumbnail](/images/publishers\afnor_cover.gif)
NF EN IEC 60749-10:2022
Current
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\afnor_cover.gif)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-06-2022
Publisher
This part ofIEC 60749is intended to evaluatedevicesin thefree stateand assembled to printed wiring boards for use in electrical equipment.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.