NF EN IEC 60749-10:2022
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-06-2022
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part ofIEC 60749is intended to evaluatedevicesin thefree stateand assembled to printed wiring boards for use in electrical equipment.
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| Pages |
16
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-10:2022 | Identical |
| IEC 60749-10:2022 | Identical |
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