NF EN IEC 60749-15:2020
Current
Current
The latest, up-to-date edition.
Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-09-2020
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-15:2020 | Identical |
| IEC 60749-15:2020 | Identical |
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