NF EN IEC 60749-15:2020
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Current
The latest, up-to-date edition.
Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-09-2020
Publisher
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.
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