NF EN IEC 60749-37:2022
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Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Published date
01-11-2022
Publisher
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This part ofIEC 60749provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components forhandheld electronic productapplications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 60749-37:2022 | Identical |
| IEC 60749-37:2022 | Identical |
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