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NF EN ISO 9453 : 2014

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by

SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS

Published date

12-01-2013

Withdrawn date

01-10-2021

Superseded by

NF EN ISO 9453:2020

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La présente Norme internationale spécifie les exigences concernant les compositions chimiques pour les familles suivantes de produits de brasage tendre: - étain-plomb, avec ou sans antimoine, bismuth, cadmium, cuivre et argent; - étain-antimoine; - étain-bismuth; - étain-cuivre, avec ou sans argent; - étain-indium, avec ou sans argent et bismuth; - étain-argent, avec ou sans cuivre et bismuth; - étain-zinc, avec ou sans bismuth. Des indications relatives aux formes couramment disponibles sont également incluses.

DevelopmentNote
Indice de classement: A81-363. PR NF EN ISO 9453 July 2005. (07/2005) Supersedes NF EN 29453. (03/2007) PR NF EN ISO 9453 June 2013. (07/2013)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Withdrawn
SupersededBy

Standards Relationship
NBN EN ISO 9453 : 2014 Identical
BS EN ISO 9453:2014 Identical
I.S. EN ISO 9453:2014 Identical
NEN EN ISO 9453 : 2014 Identical
ISO 9453:2014 Identical
DIN EN ISO 9453:2014-12 Identical
ONORM EN ISO 9453 : 2014 Identical
EN ISO 9453:2014 Identical
NS EN ISO 9453 : 2014 Identical
UNE-EN ISO 9453:2015 Identical

NFH 00 313 : 2014 FLEXIBLE PACKAGING FOR THE PROTECTION OF ITEMS AGAINST ELECTROSTATIC DISCHARGES AND AGAINST ELECTROMAGNETIC FIELDS - CHARACTERISTICS AND TEST METHODS
NF ISO 7195 : 2005 NUCLEAR ENERGY - PACKAGING OF URANIUM HEXAFLUORIDE (UF6) FOR TRANSPORT
NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications

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