NFC 26 226 : 1991

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

METHODS OF TEST FOR ELECTRIC STRENGTH OF SOLID INSULATING MATERIALS - TESTS AT POWER FREQUENCIES

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Superseded date: 01-06-1998

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Published date: 12-01-2013

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This standard gives methods of test for the determination of solid insulating materials at power frequencies; that is, those between 48 Hz and 62 Hz.

Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Superseded
Superseded By	NF EN 60243-1 : 2013

Equivalent Standard(s)	Relationship
HD 559.1 : 200S1	Identical

NF EN 60464-2 : 2002 AMD 1 2006	VARNISHES USED FOR ELECTRICAL INSULATION - PART 2: METHODS OF TEST
NF EN 60371 3-6 : 1995 AMD 1 2007	SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 6: GLASS-BACKED MICA PAPER WITH A B-STAGE EPOXY RESIN BINDER
NF EN ISO 11542-2 : 1999	PLASTICS - ULTRA-HIGH-MOLECULAR-WEIGHT POLYETHYLENE (PE-UHMW) MOULDING AND EXTRUSION MATERIALS - PART 2: PREPARATION OF TEST SPECIMENS AND DETERMINATION OF PROPERTIES
NF EN 60674-2 : 98 AMD 1 2002	SPECIFICATION FOR PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 2: METHODS OF TEST
NF EN 60371 3-4 : 1995 AMD 1 2007	SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 4: POLYESTER FILM-BACKED MICA PAPER WITH A B-STAGE EPOXY RESIN BINDER
NF EN 60371 3-7 : 1996 AMD 1 2007	INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATION OF INDIVIDUAL MATERIALS - SHEET 7: POLYESTER FILM MICA PAPER WITH AN EPOXY RESIN BINDER FOR SINGLE CONDUCTOR TAPING

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This standard gives methods of test for the determination of solid insulating materials at power frequencies; that is, those between 48 Hz and 62 Hz.

Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Superseded
Superseded By	NF EN 60243-1 : 2013

Equivalent Standard(s)	Relationship
HD 559.1 : 200S1	Identical

NF EN 60464-2 : 2002 AMD 1 2006	VARNISHES USED FOR ELECTRICAL INSULATION - PART 2: METHODS OF TEST
NF EN 60371 3-6 : 1995 AMD 1 2007	SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 6: GLASS-BACKED MICA PAPER WITH A B-STAGE EPOXY RESIN BINDER
NF EN ISO 11542-2 : 1999	PLASTICS - ULTRA-HIGH-MOLECULAR-WEIGHT POLYETHYLENE (PE-UHMW) MOULDING AND EXTRUSION MATERIALS - PART 2: PREPARATION OF TEST SPECIMENS AND DETERMINATION OF PROPERTIES
NF EN 60674-2 : 98 AMD 1 2002	SPECIFICATION FOR PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 2: METHODS OF TEST
NF EN 60371 3-4 : 1995 AMD 1 2007	SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 4: POLYESTER FILM-BACKED MICA PAPER WITH A B-STAGE EPOXY RESIN BINDER
NF EN 60371 3-7 : 1996 AMD 1 2007	INSULATING MATERIALS BASED ON MICA - PART 3: SPECIFICATION OF INDIVIDUAL MATERIALS - SHEET 7: POLYESTER FILM MICA PAPER WITH AN EPOXY RESIN BINDER FOR SINGLE CONDUCTOR TAPING