OVE EN IEC 61188-6-2:2023 04 01
Current
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies - Design and use -- Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) ((IEC 61188-6-2:2021) EN IEC 61188-6-2:2021) (english version)
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2023
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
60
|
| PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
|
| Status |
Current
|
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