OVE EN IEC 61189-2-807:2023 02 01
Current
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021)
Available format(s)
Hardcopy
Language(s)
English, German
Published date
01-02-2023
| Committee |
TC 91
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-1019-8
|
| Pages |
28
|
| PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
|
| Status |
Current
|
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