PD IEC/PAS 62647-1:2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
Hardcopy , PDF
English
31-05-2012
30-11-2012
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Objectives
6 Technical requirements
7 Plan administrative requirements
Bibliography
Describes the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that Aerospace and High Performance (AHP) electronic systems containing Pb-free solder, piece parts, and boards will Satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
| Committee |
GEL/107
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
IEC/PAS 62647-1:2011(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and high performance electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. The goal is to communicate requirements for a Lead-free Control Plan (LFCP) and to assist suppliers in the development of their own plans.
| Standards | Relationship |
| IEC PAS 62647-1:2011 | Identical |
| IEC PAS 62647-2:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Important note : Users cannot be edited or removed once added to your Multi user PDF.