PD IEC/TR 60068-3-12:2007
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
30-04-2007
Publisher
Superseded date
17-10-2014
Superseded by
€188.48
Excluding VAT
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
| Standards | Relationship |
| IEC TR 60068-3-12:2007 | Identical |
Summarise
Important note : Users cannot be edited or removed once added to your Multi user PDF.