PD IEC TR 62380:2004

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Conditions of use
   4.1 Introductory remarks
   4.2 Assumptions adopted for TR 62380
   4.3 Influencing factors
   4.4 How to use the data
   4.5 Uses and aims of a reliability prediction
5 Environment influence
   5.1 General remarks
   5.2 Environment types defined
   5.3 Electrical environment conditions
   5.4 Validity model according to environment
   5.5 Components choice
   5.6 Learning during the deployment phase of new equipment
   5.7 Mission profile
   5.8 Mission profile examples
6 Equipped printed circuit boards and hybrid circuits
   (IEC 60326)
   6.1 Failure rate calculation of an equipped printed
        circuit board
   6.2 Hybrid circuits
7 Integrated circuits
   7.1 Validity domain
   7.2 Junction temperature evaluation of an integrated
        circuit
   7.3 The reliability model
8 Diodes and thyristors, transistors, optocouplers
   (IEC 60747-xx)
   8.1 Evaluating the junction temperature of diodes and
        transistors
   8.2 Low power diodes
   8.3 Power diodes
   8.4 Low power transistors
   8.5 Power transistors
   8.6 Optocouplers
9 Optoelectronics
   9.1 Light emitting diodes diode modules (IEC 60747-12-2,
        IEC 62007)
   9.2 Laser diodes modules - Failure rate
   9.3 Photodiodes and receiver modules for telecommunications
        (IEC 60747-12)
   9.4 Passive optic components
   9.5 Miscellaneous optic components
10 Capacitors and thermistors (ntc)
   10.1 Fixed plastic, paper, dielectric capacitors -
        Radio interference suppression capacitors
        (plastic, paper)
   10.2 Fixed ceramic dielectric capacitors - Defined
        temperature coefficient - Class I (IEC 60384)
   10.3 Fixed ceramic dielectric capacitors - Non defined
        temperature coefficient - Class II - Radio
        interference suppression capacitors (Ceramic,
        class II)
   10.4 Tantalum capacitors, solid electrolyte (IEC 60384)
   10.5 Aluminum, non-solid electrolyte - Life expectancy
   10.6 Aluminum electrolytic capacitor, solid electrolyte
   10.7 Aluminum electrolytic capacitor, polymer electrolyte
        (IEC 60384)
   10.8 Variable ceramic capacitors, disks (Dielectric
        ceramic) (IEC 60384)
   10.9 Thermistors with negative temperature coefficient
        (NTC) (IEC 60539)
        (NTC) (IEC 60539)
11 Resistors and potentiometers (IEC 60115)
   11.1 Fixed low dissipation film resistors - High
        stability (rs), general purpose (rc), "minimelf"
   11.2 Hot molded carbon composition, fixed resistors
        (IEC 60115)
   11.3 Fixed, high dissipation film resistors (IEC 60115)
   11.4 Low dissipation wirewound resistors (IEC 60115)
   11.5 High dissipation wirewound resistors (IEC 60115)
   11.6 Fixed, low dissipation surface mounting resistors
        and resistive array (IEC 60115)
   11.7 Non wirewound cermet potentiometer (one or several
        turn) (IEC 60393)
12 Inductors and transformers (IEC 61248)
13 Microwave passive components, piezoelectric components and
   surface acoustic wave filters (IEC 61261, IEC 61019,
   IEC 61368)
   13.1 Microwave passive components
   13.2 Piezoelectric components
   13.3 Surface acoustic wave filters
14 Relays
   14.1 Evaluating voltage and current (vt, it) in transient
        conditions
   14.2 Mercury wetted reed relays, low power (IEC 60255)
   14.3 Dry reed relays (IEC 60255)
   14.4 Electromechanical relays, miniature or card -
        European type, thermal relays (power up to 500 W)
        (IEC 60255)
   14.5 Industrial relays, high voltage vacuum relays,
        power mercury wetted relays (IEC 60255)
15 Switches and keyboards (IEC 60948)
16 Connectors
   16.1 Circular, rectangular
   16.2 Coaxial connectors
   16.3 Connectors for PCBs and related sockets
17 Displays, solid state lamps
   17.1 Displays (IEC 61747)
   17.2 Solid state lamps (IEC 61747)
18 Protection devices (IEC 60099, IEC 60269, IEC 60738,
   IEC 61051)
   18.1 Thermistors (PTC)
   18.2 Varistors
   18.3 Fuses
   18.4 Arrestors
19 Energy devices, thermal management devices, disk drive
   19.1 Primary batteries
   19.2 Secondary batteries
   19.3 Fans
   19.4 Thermoelectric coolers
   19.5 Disk drive
   19.6 Converters (IEC 60146)

Provides elements to calculate failure rate of mounted electronics components. It makes equipment reliability optimization studies easier to carry out.

This technical report provides elements to calculate failure rate of mounted electronic components. It makes equipment reliability optimization studies easier to carry out, thanks to the introduction of influence factors.