FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Conditions of use
4.1 Introductory remarks
4.2 Assumptions adopted for TR 62380
4.3 Influencing factors
4.4 How to use the data
4.5 Uses and aims of a reliability prediction
5 Environment influence
5.1 General remarks
5.2 Environment types defined
5.3 Electrical environment conditions
5.4 Validity model according to environment
5.5 Components choice
5.6 Learning during the deployment phase of new equipment
5.7 Mission profile
5.8 Mission profile examples
6 Equipped printed circuit boards and hybrid circuits
(IEC 60326)
6.1 Failure rate calculation of an equipped printed
circuit board
6.2 Hybrid circuits
7 Integrated circuits
7.1 Validity domain
7.2 Junction temperature evaluation of an integrated
circuit
7.3 The reliability model
8 Diodes and thyristors, transistors, optocouplers
(IEC 60747-xx)
8.1 Evaluating the junction temperature of diodes and
transistors
8.2 Low power diodes
8.3 Power diodes
8.4 Low power transistors
8.5 Power transistors
8.6 Optocouplers
9 Optoelectronics
9.1 Light emitting diodes diode modules (IEC 60747-12-2,
IEC 62007)
9.2 Laser diodes modules - Failure rate
9.3 Photodiodes and receiver modules for telecommunications
(IEC 60747-12)
9.4 Passive optic components
9.5 Miscellaneous optic components
10 Capacitors and thermistors (ntc)
10.1 Fixed plastic, paper, dielectric capacitors -
Radio interference suppression capacitors
(plastic, paper)
10.2 Fixed ceramic dielectric capacitors - Defined
temperature coefficient - Class I (IEC 60384)
10.3 Fixed ceramic dielectric capacitors - Non defined
temperature coefficient - Class II - Radio
interference suppression capacitors (Ceramic,
class II)
10.4 Tantalum capacitors, solid electrolyte (IEC 60384)
10.5 Aluminum, non-solid electrolyte - Life expectancy
10.6 Aluminum electrolytic capacitor, solid electrolyte
10.7 Aluminum electrolytic capacitor, polymer electrolyte
(IEC 60384)
10.8 Variable ceramic capacitors, disks (Dielectric
ceramic) (IEC 60384)
10.9 Thermistors with negative temperature coefficient
(NTC) (IEC 60539)
(NTC) (IEC 60539)
11 Resistors and potentiometers (IEC 60115)
11.1 Fixed low dissipation film resistors - High
stability (rs), general purpose (rc), "minimelf"
11.2 Hot molded carbon composition, fixed resistors
(IEC 60115)
11.3 Fixed, high dissipation film resistors (IEC 60115)
11.4 Low dissipation wirewound resistors (IEC 60115)
11.5 High dissipation wirewound resistors (IEC 60115)
11.6 Fixed, low dissipation surface mounting resistors
and resistive array (IEC 60115)
11.7 Non wirewound cermet potentiometer (one or several
turn) (IEC 60393)
12 Inductors and transformers (IEC 61248)
13 Microwave passive components, piezoelectric components and
surface acoustic wave filters (IEC 61261, IEC 61019,
IEC 61368)
13.1 Microwave passive components
13.2 Piezoelectric components
13.3 Surface acoustic wave filters
14 Relays
14.1 Evaluating voltage and current (vt, it) in transient
conditions
14.2 Mercury wetted reed relays, low power (IEC 60255)
14.3 Dry reed relays (IEC 60255)
14.4 Electromechanical relays, miniature or card -
European type, thermal relays (power up to 500 W)
(IEC 60255)
14.5 Industrial relays, high voltage vacuum relays,
power mercury wetted relays (IEC 60255)
15 Switches and keyboards (IEC 60948)
16 Connectors
16.1 Circular, rectangular
16.2 Coaxial connectors
16.3 Connectors for PCBs and related sockets
17 Displays, solid state lamps
17.1 Displays (IEC 61747)
17.2 Solid state lamps (IEC 61747)
18 Protection devices (IEC 60099, IEC 60269, IEC 60738,
IEC 61051)
18.1 Thermistors (PTC)
18.2 Varistors
18.3 Fuses
18.4 Arrestors
19 Energy devices, thermal management devices, disk drive
19.1 Primary batteries
19.2 Secondary batteries
19.3 Fans
19.4 Thermoelectric coolers
19.5 Disk drive
19.6 Converters (IEC 60146)