PD IEC/TR 62658:2013
Current
The latest, up-to-date edition.
Roadmap of optical circuit boards and their related packaging technologies
Hardcopy , PDF
English
30-09-2013
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FOREWORD
1 Scope
2 General
3 Standardization of board-level optical packaging
4 Standardization road map
5 Standardization road map of optical circuit boards
Bibliography
Includes the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards.
| Committee |
GEL/86
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This Technical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards.
| Standards | Relationship |
| IEC TR 62658:2013 | Identical |
| IEC TS 62661-2-1:2013 | Optical backplanes - Product specification - Part 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors |
| IEC 62496-1:2008 | Optical circuit boards - Part 1: General |
| IEC 61754-26:2012 | Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 26: Type SF connector family |
| IEC 61754-25:2008 | Fibre optic connector interfaces - Part 25: Type RAO connector family |
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