PN EN 60191-6-17 : 2011
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
Published date
12-01-2013
Publisher
Sorry this product is not available in your region.
Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-17:2011 | Identical |
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