PN EN 60749-15 : 2011 AC 2011
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
14-04-2021
12-01-2013
Specifies a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 60749-15:2010 | Identical |
| EN 60749-15:2010/AC:2011 | Identical |
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