PN EN 62137-3 : 2012

Current

Current The latest, up-to-date edition.

ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS

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Published date: 12-01-2013

Publisher: Polish Committee for Standardization

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Specifies the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.

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Committee	TC 293
Document Type	Standard
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Pages
Published
Publisher	Polish Committee for Standardization
Status	Current

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Equivalent Standard(s)	Relationship
IEC 62137-3:2011	Identical
EN 62137-3:2012	Identical

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