PN-EN IEC 60749-15:2021-04
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic tests - Part 15: Soldering temperature resistance of through hole assembly devices
Available format(s)
Hardcopy
Language(s)
English
Published date
14-04-2021
Publisher
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-15:2020 | Identical |
| IEC 60749-15:2020 | Identical |
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