PN-EN IEC 61189-5-601:2021-10
Current
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed circuit boards and other interconnection structures and assemblies - Part 5-601: General methods for testing materials and assemblies - Test of reflow soldering ability to solder and test of PCB resistance to the heat of reflow soldering
Available format(s)
Hardcopy
Language(s)
English
Published date
29-10-2021
Publisher
| DocumentType |
Test Method
|
| Pages |
50
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
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