PNE-prEN 61190-1-2
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published date
02-10-2007
Publisher
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| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| PublisherName |
Asociacion Espanola de Normalizacion
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61190-1-2:2007 | Identical |
| EN 61190-1-2:2007 | Identical |
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