PNE-prEN 61190-1-3
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Published date
02-10-2007
Publisher
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Committee |
CTN 203/SC 91-119
|
DocumentType |
Standard
|
PublisherName |
Asociacion Espanola de Normalizacion
|
Status |
Current
|
Standards | Relationship |
EN 61190-1-3:2007 | Identical |
IEC 61190-1-3:2007 | Identical |
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