PNE-prEN IEC 60749-20-1:2023
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Amendment of
Published date
05-11-2023
Publisher
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| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| PublisherName |
Asociacion Espanola de Normalizacion
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-20-1:2019 | Identical |
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