FOREWORD
PREFACE
Clause
1 Scope
2 Object
3 Terminology
4 Test Ta: Solderability of wire and tag terminations
5 Test Tb: Resistance of components to soldering heat
6 Test Tc: Solderability of printed boards and metal-clad laminates
APPENDIX A — Example of apparatus for accelerated steam ageing process
APPENDIX B — Specification for solde
APPENDIX C — Specification for flux constituents
APPENDIX D — Specification for solder globule apparatus
APPENDIX E — Specimen holder and timing needle arrangement