SAC GB/T 15879.612:2025
Current
Current
The latest, up-to-date edition.
Mechanical Standardization of Semiconductor Devices, Parts 6-12: General Rules for Drawing Outlines of Surface Mount Semiconductor Device Packages - Design Guidelines for Close Pitch Pad Array Packages (FLGA)
Available format(s)
Hardcopy
Language(s)
English
Published date
31-12-2025
Publisher
€484.97
Excluding VAT
Summarise this standard
AI-generated summary
| DocumentType |
Standard
|
| Pages |
2
|
| PublisherName |
Standardization Administration of China
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-12:2011 | Identical |
€484.97
Excluding VAT