Name: SAC GB/T 45713.4:2025 - Electronic Assembly Technology Part 4: Durability Test Methods for Solder Joints of Array-Packed Surface Mount Devices
Brand: Standardization Administration of China

Electronic Assembly Technology Part 4: Durability Test Methods for Solder Joints of Array-Packed Surface Mount Devices

Available format(s)

Hardcopy

Language(s)

English

Published date

30-05-2025

Publisher

Standardization Administration of China

€615.30

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DocumentType	Test Method
Pages	877
PublisherName	Standardization Administration of China
Status	Current

Standards	Relationship
IEC 62137-4:2014	Identical

€615.30

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SAC GB/T 45713.4:2025

Electronic Assembly Technology Part 4: Durability Test Methods for Solder Joints of Array-Packed Surface Mount Devices

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