Name: SAC GB/T 4937.201:2026 - Semiconductor Devices Mechanical and Climate Testing Methods Part 20-1: Handling, Packaging, Marking, and Transport of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat
Brand: Standardization Administration of China

Semiconductor Devices Mechanical and Climate Testing Methods Part 20-1: Handling, Packaging, Marking, and Transport of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat

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Hardcopy

Language(s)

English

Published date

30-04-2026

Publisher

Standardization Administration of China

€666.64

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DocumentType	Test Method
Pages	689
PublisherName	Standardization Administration of China
Status	Current
Supersedes	SAC GB/T 4937.201:2018

Standards	Relationship
IEC 60749-20-1:2019	Identical

€666.64

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SAC GB/T 4937.201:2026

Semiconductor Devices Mechanical and Climate Testing Methods Part 20-1: Handling, Packaging, Marking, and Transport of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat

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