SAE ARP 1612 : 2014
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
POLYIMIDE PRINTED CIRCUIT BOARDS, FABRICATION OF
Hardcopy , PDF
14-06-2022
English
14-08-2014
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1. SCOPE
2. APPLICABLE DOCUMENTS
3. GENERAL
4. PROCESS RECOMMENDATIONS
5. MULTILAYER PRINTED WIRING BOARD
FABRICATION CYCLE
6. DOUBLE-SIDED PRINTED WIRING BOARD
FABRICATION CYCLE
7. QUALITY ACCEPTANCE REQUIREMENTS, POLYIMIDE
PRINTED WIRING BOARDS
8. APPROVAL
9. SAFETY
10. REFERENCE DOCUMENTS
11. NOTES
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards.
| Committee |
AMS-P17
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
SAE International
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| GEIA TA HB 0009 : 2013 | RELIABILITY PROGRAM HANDBOOK |
| MIL P 13949/10 : B | PLASTIC SHEET, LAMINATED, METAL CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GI, GLASS BASE, WOVEN, POLYIMIDE RESIN, HEAT RESISTANT, COPPER CLAD |
| A-A-113 Revision D:1996 | TAPE PRESSURE-SENSITIVE ADHESIVE |
| MIL-STD-275 Revision E:1984 | PRINTED WIRING - ELECTRONIC EQUIPMENT |
| MIL P 13949/13 : A | PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), GI BASE MATERIAL, GLASS FABRIC WOVEN, POLYIMIDE RESIN PREIMPREGNATED (B-STAGE) |
| FED-STD-406 Revision A:1982 | PLASTIC, METHODS OF TESTING |
| SAE AMS 2350 : 1989 | STANDARDS AND TEST METHODS |
| MIL B 22191 : D | BARRIER MATERIAL, TRANSPARENT, FLEXIBLE, HEAT SEALABLE |
| MIL-F-14256 Revision F:1993 | FLUX, SOLDERING, LIQUID (ROSIN BASE) |
| MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD, (ELECTRODEPOSITED) |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL P 55110 : LATEST | PRINTED WIRING BOARD, RIGID GENERAL SPECIFICATION FOR |
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