SAE ARP1612A
Current
The latest, up-to-date edition.
Polyimide Printed Circuit Boards Fabrication of
Hardcopy , PDF
English
05-06-2022
Important note : Users cannot be edited or removed once added to your Multi user PDF.This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards.
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
SAE International
|
| Status |
Current
|
| Supersedes |
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
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