SAE AS6171/4
Current
The latest, up-to-date edition.
Techniques for Suspect/Counterfeit EEE Parts Detection by Delid/Decapsulation Physical Analysis Test Methods
Hardcopy , PDF
English
30-10-2016
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1. SCOPE
2. REFERENCES
3. DESCRIPTION OF THE METHODOLOGY/PROCEDURE - MICROCIRCUITS,
HYBRIDS, DIODES, AND TRANSISTORS
4. DESCRIPTION OF THE PROCEDURE - RESISTORS, CAPACITORS,
INDUCTORS, FILTERS, CONNECTORS, CABLES, FUSES, TRANSFORMERS
(PASSIVE DEVICES)
5. TEST EQUIPMENT, TEST SAMPLES, AND CALIBRATION
6. DETAILED REQUIREMENTS
7. ALTERNATE PACKAGE/MATERIAL TYPES
8. NOTES
APPENDIX A - DECAPSULATION AND PHOTO-DOCUMENTATION EXAMPLES
APPENDIX B - VISUAL ANOMALY EXAMPLES
APPENDIX C - UNACCEPTABLE DECAPSULATION RESULTS
APPENDIX D - PROFICIENCY SAMPLE QUESTIONS (FOR INTERNAL USE ONLY)
Regulates inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis.
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
SAE International
|
| Status |
Current
|
This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to:aprevent inclusion of counterfeit parts in the assemblybidentify defective partscaid in disposition of parts that exhibit anomaliesThis test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.Due to the destructive nature of the test method that allows access to materials, design and layout information, the method may also enable observation of trends in design and material or process changes undertaken by the device manufacturer.If AS6171/4 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
| 18/30373170 DC : 0 | BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
| SAE AS6171/11 | Techniques for Suspect/Counterfeit EEE Parts Detection by Design Recovery Test Methods |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| SAE AS6171 | Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| SAE AS6171 | Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| SAE AS 6171/5 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RADIOLOGICAL TEST METHODS |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.