SAE AS6294/1
Current
The latest, up-to-date edition.
Requirements for Plastic Encapsulated Microcircuits in Space Applications
Hardcopy , PDF
English
21-11-2017
RATIONALE
ACKNOWLEDGMENT
1. SCOPE
2. REFERENCES
3. GENERAL REQUIREMENTS
4. Device Classification Determination
5. DEVICE CHARACTERIZATION
6. REQUIREMENTS FOR SCREENING
7. BURN-IN AND ELECTRICAL MEASUREMENT
REQUIREMENTS
8. REQUIREMENTS FOR LOT ACCEPTANCE
TESTING
9. NOTES
APPENDIX A - PEM Capability Requirements Determination
This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
SAE International
|
| Status |
Current
|
This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.
| MIL-HDBK-814 Base Document:1994 | Ionizing Dose and Neutron Hardness Assurance Guidelines for Microcircuits and Semiconductor Devices |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| NASA STD 6001 : 2011 | FLAMMABILITY, OFFGASSING, AND COMPATIBILITY REQUIREMENTS AND TEST PROCEDURES |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| MIL-STD-1580 Revision B:2003 | Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
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