SAE J1879_201402

1. INTRODUCTION
2. SCOPE
3. TERMS, DEFINITIONS AND ABBREVIATIONS
4. ROBUSTNESS VALIDATION BASICS
5. MISSION PROFILE/VEHICLE REQUIREMENTS
6. TECHNOLOGY DEVELOPMENT
7. PRODUCT DEVELOPMENT
8. POTENTIAL RISKS AND FAILURE MECHANISMS
9. CREATION OF THE QUALIFICATION PLAN
10. STRESS AND CHARACTERIZATION
11. ROBUSTNESS ASSESSMENT
12. IMPROVEMENT
13. MONITORING
14. REPORTING AND KNOWLEDGE EXCHANGE
15. EXAMPLES
16. ANNEX KNOWLEDGE MATRIX
17. ANNEX REPORTING TEMPLATE
18. REFERENCES AND ADDITIONAL READING
19. NOTES

Specifies intrinsic reliability of electronic components for use in automotive electronics.

This document will primarily address intrinsic reliability of electronic components for use in automotive electronics. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. The current handbook primarily focuses on integrated circuit subjects, but can easily be adapted for use in discrete or passive device qualification with the generation of a list of failure mechanisms relevant to those components. Semiconductor device qualification is the main scope of the current handbook.Other procedures addressing extrinsic defects are particularly mentioned in the monitoring chapter. Striving for the target of Zero Defects in component manufacturing and product use it is strongly recommended to apply this handbook. If it gets adopted as a standard, the term “shall” will represent a binding requirement.This document does not relieve the supplier of the responsibility to assure that a product meets the complete set of its requirements.